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      4. Awards & Accolades

        1. February

          Awarded the 2020 New Product Introduction (NPI) Awards for Component Placement – Accessory Technologies: Siplace SmartFeeder AutoRefill.
          Awarded by Circuits Assembly and Printed Circuit Design and FAB


          Awarded the 2020 Innovation Awards for ASM DEK TQ (Category: Assembly Equipment)
          Awarded by IPC


          Recognised ASM Technology Singapore (ATS) as a valued partner in Learning Enterprise Alliance (LEA) 2020.
          Awarded by Institute for Adult Learning Singapore


          January

          Recognized ASM Technology Singapore (ATS) for supporting the Professional Conversion Programme (PCP) in the electronic industry.
          Awarded by the Singapore Semiconductor Industry Association (SSIA), with support from Workforce Singapore.

        2. December

          “Company of the Year 2019” in the SMT category
          Awarded by CIO Review India Magazine


          Hong Kong Corporate Citizenship Award Scheme (Enterprise Category): Merit Award
          Awarded by Hong Kong Productivity Council – HKET


          "Best Innovative Recruitment Campaign Award": Platinum Award
          "Best Office Facilities Award": Platinum Award
          Awarded by CTgoodjobs’ Best HR Awards 2019.



          2019 Junzi Corporate Award
          James Chow, EVP for Business Excellence, receiving the 2019 Junzi Corporate Award on behalf of CEO Lee Wai Kwong.


          November

          "Industrialist Of The Year" Award 2019
          Awarded by Federation of Hong Kong Industries (FHKI)


          ASM Amicra awarded the Productronica Innovation Award 2019 in the Semiconductor Cluster for CoS Die-Bonder
          Awarded by productronica in collaboration with "productronic” magazine at productronica 2019.


          October

          Singapore Quality Award 2019
          Awarded by Enterprise Singapore


          ASM Technology Singapore (ATS) was honored with the Best Practices Award at the EENP Awards 2019.
          Awarded by Energy Efficiency National Partnership (EENP) – A National Environment Agency (NEA) programme.


          September

          Asia's Outstanding Companies Poll 2019
          Awarded by Asiamoney


          ASM Assembly Systems awarded the “Manufacturing Excellence in Printing Solutions” (Printing Solutions Divisions (DEK)) and “Smart SMT Factory Award” (Placement Solutions Divisions (SIPLACE)).
          Awarded by Electronics Maker Magazine at productronica India 2019 exhibition.


          ASM Assembly Systems's India Sales office awarded the “Excellence in Customer Service Award”
          By Incap Contract Manufacturing Services Pvt. Ltd.


          August


          July

          HKMA Quality Award Grand Award 2019
          Awarded by Hong Kong Management Association


          June

          , "10 BEST Chip Making Suppliers" and "The BEST Assembly and Test Suppliers" from VLSI Customers Satisfaction Survey 2019
          Recieving VLSI Research awards for the third year. Also awarded in 2018 and 2017.

        3. Recognized as 2018 Thomson Reuters Top 100 Global Technology Leaders


          Awarded 2018 Factory of the Year/Global Excellence in Operations (GEO) Award in the Excellent Production Network category by Produktion magazine and AT Kearney.
          Honoring Munich (Germany), Weymouth (UK), Singapore and Malaysia SMT productions.


          ASM Pacific Technology awarded Singapore Quality Class 2018


          "Ranked 1st in Assembly", "10 BEST Chip Making Suppliers" and "The BEST Assembly and Test Suppliers" from VLSI Customers Satisfaction Survey 2018
          Honored with 3 awards for a second year

        4. ASM Pacific Technology celebrates Third Time Win in Technological Achievement Grand Award of the Hong Kong Awards for Industries (HKIA) 2017


          ASM ?Pacific Technology won " The Directors of the Year Awards 2017"


          ASM Pacific Technology named "Hong Kong Outstanding Enterprise"


          Honored?with 3 awards - Ranked 1st in Assembly, 10 BEST Chip Making?Suppliers and The?BEST Assembly and Test Suppliers from VLSI Customers Satisfaction Survey 2017


          Awarded one of the “Best Investor Relations Company” and Asia's Best CEO (Investor Relations)?by Corporate Governance Asia


          Ranked Among the 10 BEST Large Semiconductor Equipment Suppliers in the VLSI Customer Satisfaction Survey 2017


          Received 25 Years Supplier Partnership Award from Unisem Group


          Received Best Partner Supplier Award from Tongfu Microelectronics Co. Ltd


        5. Awarded the 2016 New Product Introduction (NPI) Awards for Automation Tools: Siplace Bulkfeeder X
          Awarded by Circuits Assembly


          Munich factory was awarded Factory of the Year 2016 Award by Produktion/AT Kearney?


          Ranked among the top 10 Hong Kong companies in two categories: “Best Managed Companies” and “Best at Investor Relations” by FinanceAsia


          Ranked Among the Top 5 in the VLSI Customer Satisfaction Survey 2016


          Ranked 3rd in the category of Assembly Equipment and 4th in Test Equipment in the VLSI Customer Satisfaction Survey 2016


          2016 Corporate Governance Asia – Best Investor Relations Company


          Received 2015 Supplier Excellence Award by Texas Instruments


          Received the Best FOL Equipment Supplier and Best Quality Supplier awards by Hana Semiconductor (Ayutthaya)


          Received the 2015 Best Supplier award by ASE Group


        6. Hong Kong Awards for Industries: Technological Achievement Grand Award (TCB system)


          Ranked as the “Top Supplier” by the VLSIresearch


        7. Awarded the "Best Small Cap - Hong Kong" in the FinanceAsia's “Asia's Best Companies Poll 2014

        8. SMT Solutions Business honored with the German "Global Excellence in Operations" Award

        9. ATS received the “International Headquarters Award” from the Singapore Economic Development Board

        10. Advanced Packaging Award: Die Equipment and Materials category (MCM12)


          Advanced Packaging Award: Dispensing/ Encapsulation/ Molding/ Underfill Equipment & Materials category (IDEALcompress?)

        11. Named the “2007 Overall Best Managed Company” in Hong Kong in the mid-cap category by AsiaMoney


          Ranked as the 8th in the “Best Managed Company” in Hong Kong by FinanceAsia


          Awarded the top 3 for the “Best Mid-cap” category by FinanceAsia


          Ranked as the top 10 for Best Investor Relations and top 5 for Most Committed to a Strong Dividend Policy

        12. Semiconductor International “Editor’s Choice Best Product” Award (Osprey)

        13. Advanced Packaging Award: Dispensing/Encapsulation/Molding/Underfill Equipment & Materials category (Osprey)


          Advanced Packaging Award: Wire Bonding Equipment category (Harrier)


          Advanced Packaging Award: Substrate & Submount Equipment & Materials category (BP2000)

        14. Semiconductor International “Editor's Choice Best Products” Award (IDEALmold?)


          Advanced Packaging Award: Encapsulation/Molding category (IDEALmold?)


          Advanced Packaging Award: Die Attach Equipment and Material category (AD898CC Automatic Die Donder with clean cell system / GA898CC Automatic Glass Bonder)


          Voted as one of the Asia’s “Top Ten Best Managed Company in Hong Kong” in a survey by FinanceAsia


          Ranked as the “Top 10 Best Suppliers” by the VLSIresearch


        15. Advanced Packaging Award: Encapsulation/Molding category (IDEALmold? R2R)


          Advanced Packaging Award: Wire Bonding category (Eagle60 Wire Bonder)


          Advanced Packaging Award: Handling Equipment/Handling category (NRTH Test Handler)


          Ranked as the “Top 10 Best Suppliers” by the VLSIresearch


        16. Advanced Packaging Award: Encapsulation/Molding category (IDEALmold? Application for Pinnacle Gating System and Soft Technology)


          Advanced Packaging Award: Die Placement & Attach category (AD8912 Automatic Die Bonder)


          Ranked as the “Top Supplier” by the VLSIresearch

        17. Semiconductor International “Editor's Choice Best Products” Award ( AB339 Eagle-Ultra Fine Pitch Gold Wire Bonder)


          Ranked as the “Top 10 Best Suppliers” by the VLSIresearch


        18. Ranked as the “Top 10 Best Suppliers” by the VLSIresearch


          ASM China was ranked as China's top 200 exporters


        19. Conferred the Hong Kong Awards for Industries: Technological Achievement Award


          Conferred the National Science and Technology Board of Singapore: Technology Achievement Award

        20. Semiconductor International “Editor's Choice Best Products” Award (AB339 Gold Wire Bonder)

        21. The Governor’s Award for Hong Kong Design Competition: The Most Technologically Advanced Product Award

        ISO 45001

        Occupational Health and Safety Management System

        SS506

        Occupational Health and Safety Management System

        OHSAS 18001

        Occupational Health and Safety Management System

        ISO 9001

        Quality Management System

        IATF 16949

        Quality Management System

        ISO 50001

        Energy Management System

        ISO 14001

        Environmental Management System
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