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      4. Group Structure

        • ASM Pacific Technology
            • Wire bonders
            • Die bonders
            • Encapsulation solutions
            • Test handlers
            • Clip bonders,
            • CIS ?equipment
            • TCB bonders
            • Flip chip bonders
            • Mold Under Fill (MUF)
            • Panel molding
            • Laser grooving and dicing
            • Leadframes
            • Advanced packaging materials (molded interconnect substrates)
            • Assembly line solutions
            • DEK printing systems
            • SIPLACE placement systems
            • ASM smart factory tools & services
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